24-25 May 2022 | Brussels Marriott Hotel Grand Place

Jean-Philippe Galvan

Principal Engineer, Qualcomm & Co-Chair of Eurosmart ITSC Committee

Jean-Philippe Galvan

Principal Engineer, Qualcomm & Co-Chair of Eurosmart ITSC Committee

Biography

Jean-Philippe Galvan has been involved in embedded security for 20 years. Jean-Philippe works for Qualcomm Technologies Inc. where he is participating in definition, architecture and certification of Qualcomm’s Secure Processing Unit, an integrated secure element to protect SIM, identity, biometrics and payment. Prior to Qualcomm, he worked for Texas Instruments, Samsung, Inside Secure and TrustAZUR. Jean-Philippe is actively representing Qualcomm in several standard bodies and committees, and particularly at Eurosmart and ENISA EU5G, as well as GlobalPlatform where he received three Star Awards in 2010, 2015 and 2021.

All sessions by Jean-Philippe Galvan